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HAD8606-H六头平面式高速固晶机
    发布时间: 2019-06-30 16:55    

HAD8606-H(六头平面式高速固晶机)


(单头周期:135ms

适用于Mini LED PCB

一、机型特性

1.采用国际领先的六邦头固晶,六个晶片搜寻系统;三个固晶平台内部直接连线,同一基板同时一次性完成三种芯片固晶;

2.采用直驱伺服电机驱动邦头;

3.采用线性电机驱动搜寻晶片平台(X/Y)与送料平台(B/C);

4.夹具平台底部采用吸真空方式,PCB在真空的作用下达到固晶平面高度一致,提高固晶速度及固晶质量;

5.采用真空漏晶检测;

6.采用自动式上下料,两种方式兼容进料(料盒进料,接驳台进料),以及料盒收料和接驳台接下一台设备两种方式兼容收料,很大程度提高了生产效率;

7.芯片平台增加自动换环功能,可以自动修正芯片角度;

8.工控机控制设备运行,简化了自动化设备的操作;

9.精准的设备化设备为企业提高生产效率,降低成本提供了有效保障,从而切实有效地提高了企业竞争力;

10. 精准的固晶位置及优良的一致性为后道工序提供了先天的保障。

 

HAD8606-H

Sextuple-head Plane-type High-speed Die Bonder

Single-head Cycle: 135ms

It is compatible with Mini LED PCB

 

Product Features

1.      International leading sextuple die bond, sextuple adhesive dispense and double die searching system; direct-wiring inside three die bond platforms, bonding three kinds of dies all at once on the substrate;

2.      Linear motor is applied to drive bond head;

3.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

4.      Vacuum picking method is adopted on the clamp base, uniformizing the bonding height of PCB to expedite the bonding and ensure the bonding quality simultaneously;

5.      Vacuum die missing testing technology is adopted;

6.      Automatic loading and unloading system, two ways of loading(by magazine or conveyor ) and receiving by magazine or the conveyor which connected to another machine, improving the production efficiency largely;

7.      Adding automatic ring changing function on the die platform, correcting the die theta automatically;

8.      IPC will control the operation of equipment, simplifying the usage of automation equipment;

9.      Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

10.  Precise die bond location and excellent compatibility will guarantee the back-end processing.

二、规格参数

Specifications and Parameters

1.系统功能/System Function

4、吸晶摆臂机械手系统/Die Bonder’s Swing Arm-and-hand system

生产周期/Production Cycle

135ms(单头,取决于晶片尺寸及支架)(Single-head, Depending On Die Size And Holder)

吸晶摆臂/ Die Bonder’s Swing Arm

180°旋转固晶(Rotatable Die Bond)

XY位置精度/Accuracy

±0.8mil (±0.02mm

吸晶压力/Die Bond Pressure

可调20g300g(Adjustable)

芯片旋转/Die Rotation

±2°

5.送料工作平台/Loading Workbench

2.芯片XY工作台/Die XY Workbench

行程范围/Range of Stroke

10.24"×7.87"260mm*200mm

芯片尺寸/Die Dimensions

3mil×3mil-80mil×80mil
(0.076mm*0.076mm-2mm*2mm)

XY分辨率/XY Resolution

0.02mil0.5μm

6.适用支架尺寸/Suitable Holder’s Size

晶片最大角度修正/Max.Angle Correction

±15°

支架长度/Length

170-260mm

最大芯片环尺寸/Max.Die Ring Size

6″(152mm)外径(External Diameter)

支架宽度/Width

80-200mm

最大芯片面积尺寸/Max.Die Area

4.7″(119mm)扩张后(Expanded)

7.所需设施/Facilities Needed

分辨率/Resolution Ratio

0.04mil  (1μm)

电压/频率/Voltage/Frequency

220V AC±5%/50HZ

顶针Z高度行程/Thimble Z Height Stroke

80mil2mm

压缩空气/Compressed Air

0.5MPaMIN

额定功率/Rated Power

1800W

3.图像识别系统/Image Recognition System

耗气量/Gas Consumption

5L/min

灰阶度/Grey Scale

256级灰度(Level Grey)

8.体积及重量/Volume and Weight

分辨率/Resolution

656×492像素(Pixels)

xx/Length x Width x Height

360×135×235cm

图像识别精准度/Image Recognition Accuracy

±0.025mil@50mil观测范围(Observation Range)

重量/Weight

(Roughly) 3500kg




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