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HAD129F
    發布時間: 2017-03-20 16:15    

HAD129F

直插式高速固晶機

(週期:180ms

適用於鐵、銅垂直LED

一、機型特性

1.長短引線垂直式LED燈全自動固晶的最佳選擇;


3.國內率先擁有高精度(雙PR+高速度垂直式LED固晶設備;

4.採用直驅電機驅動邦頭;

5.採用線性電機驅動晶片搜尋(X/Y)平臺與送料B/C)平臺

6.採用可程式恒溫點膠系統;

7.採用機械進料系統,避免氣壓不穩定造成進料不順;

8.採用料盒進出料方式,保證引線框架不會相互碰撞,造成不必要的損壞;

9.採用真空漏晶檢測;

10.工控機控制設備運行,簡化了自動化設備的操作。

 

HAD129F

Direct Insert-type High-speed Die Bonder

Cycle: 180ms

It can be applied to iron and copper vertical LED products. 

 

Product Features

 

1.      It is the best choice for full-automation die bond of long and short lead vertical LED light;

2.      Vertical LED high-speed die bond (180ms/piece, 20K UPH) and sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

3.      High precision(double PR) and high speed vertical LED die bond is adopted;

4.      Linear motor is applied to drive bond head;

5.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

6.      Programmed control constant-temperature adhesive dispensing system is also applied;

7.      Mechanical loading system is applied to avoid unsmooth loading caused by unstable air pressure;

8.      The magazine loading and unloading way is applied to avoid the inter-collision of lead frame and can prevent unnecessary damage;

9.      Vacuum die missing testing technology is adopted;

10.  IPC will control the operation of equipment, simplifying the operation of automation equipment.


二、規格參數

Specifications and Parameters

1.系統功能/System Function

4.圖像識別系統/Image Recognition System

生產週期/Production Cycle

180ms(取決於晶片尺寸及支架)(Depending On Die Size And Holder)

灰階度/Grey Scale

256級灰度Level Grey

晶片尺寸/Die Dimensions

5mil×5mil-80mil×80mil
(0.13mm*0.13mm-2mm*2mm)

解析度/Resolution

512x512圖元(Pixel)

通用垂直引線框架尺寸/General Vertical Lead Framework Dimensions

/L

145mm-160mm

圖像識別精准度/Image Recognition Accuracy

±0.025mil@50mil觀測範圍(Observation Range)

/T

 20mm-40mm

5.系統精准度/ System Accuracy

/H

0.3mm-0.6mm

XY位置精度/Accuracy

±1.5mil(±0.038mm

莭距/Pitch

4.5mm-15.5mm

晶片旋轉/Die Rotation

±3°

最多可容納物料/Materials Held at Most

2.5K

6.焊頭/Welding head

2. 晶片處理器/Die Processor

吸晶擺臂/Swing Arm of Die Bonder

90°旋轉焊臂(Rotatable Welding Arm)

最大晶片環尺寸/Max. Die Ring Size

8(212mm)外徑(External Diameter)

吸晶壓力/Die Bond Pressure

可調20g -250g(Adjustable)

最大晶片面積尺寸/Max. Die Area

6.5(165mm)擴張後(Expanded)

7.所需設施/Facilities Needed

最小晶片環尺寸/Min. Die Ring Size

6(152mm)外徑(External Diameter)

電壓/頻率/Voltage/Frequency

220V AC ±5% / 50HZ

壓縮空氣/Compressed Air

0.5MPaMIN

3. 晶片工作臺/Die XY Workbench

額定功率/Rated Power

700W

解析度/Resolution Ratio

0.04mil (1μm)

耗氣量/Gas Consumption

5L/min

頂針Z高度行程/Thimble Z Height Stroke

80mil(2mm)

8.體積及重量/Volume and Weight

xx/

Length x Width x Height

130x80x230cm

重量/Weight

850kg

 

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