0755-27502933 
|
|
|
|
|
|
|
公司理念:創新、高效、和諧、務實
PRODUCT  service
產品服務
 
產品分類
HAD203
    發布時間: 2019-07-23 16:00    


HAD203
(週期:
65ms

適用於印刷錫膏後的貼片二極體、三極管、光耦、手機背光源

一、機型特性

1.採用國際領先的雙固晶,雙晶片搜尋系統;

2.採用直驅電機驅動邦頭;

3.採用線性電機驅動搜尋晶片平臺(X/Y)與送料平臺(B/C);

4. 晶框採用自動角度修正系統;

5.採用真空漏晶檢測;

6. 採用自動上下料系統,減少換料時間;

7. 採用自動裝卸晶環系統,有效提高了生產效率;

8. 工控機控制設備運行,簡化了自動化設備的操作;

9.精准的設備化設備為企業提高生產效率,降低成本提供了有效保障,從而切實有效地提高了企業競爭力;

10. 精准的固晶位置及優良的一致性為後道工序提供了先天的保障。

 

HAD203

Cycle: 65ms

Plane-type High-speed Die Bonder

It is compatible with solder paste printed SMD diodeaudionoptocoupler tube and mobile-phone backlight etc.

 

Product Features

1.      International leading double die bond and double die searching system;

2.      Linear motor is applied to drive bond head;

3.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

4.      Crystal frame automatic correction chip structure is also applied

5.      Vacuum die missing testing technology is adopted;

6.      Automatic loading and unloading system is applied to saving the time of reloading;

7.      Automatic installing & uninstalling crystal rings is applied to improve the production efficiency largely;

8.      IPC will control the operation of equipment, simplifying the operation of automation equipment;

9.      Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

10.  Precise die bond location and excellent compatibility will guarantee the back-end processing.

 

 

二、規格參數

Specifications and Parameters

 

1.系統功能/System Function

4、吸晶擺臂機械手系統/

Die Bonder’s Swing Arm-and-hand system

生產週期/Production Cycle

65ms(取決於晶片尺寸及支架)(Depending On Die Size And Holder)

吸晶擺臂/Swing Arm of Die Bonder

雙擺臂120°可旋轉固晶(Rotatable Die Bond with Double Swing Arms)

XY位置精度/Accuracy (帶晶片校正功能/ With Die Correcting Feature)

±1mil(±0.025mm

吸晶壓力/Die Bond Pressure

可調20g250g(Adjustable)

晶片旋轉/Die Rotation

±2°

5.送料工作平臺/Loading Workbench

2.晶片XY工作臺/Die XY Workbench

行程範圍/Range of Stroke

75mmX300mm

晶片尺寸/Die Dimensions

5mil×5mil-80mil×80mil
(0.13mm*0.13mm-2mm*2mm)

XY解析度/XY Resolution

0.02mil0.5μm

6.適用支架尺寸/Suitable Holder’s Size

晶片最大角度修正/Max. Angle Correction

±15°

支架長度/Length

100 ~ 300mm

最大晶片環尺寸/Max. Die Ring Size

6″與8″可選(Optional)

支架寬度/Width

48~ 75mm

最大晶片面積尺寸/Max. Die Area

6119mm)、8165mm

7.所需設施/Facilities Needed

解析度/Resolution Ratio

0.04mil  (1μm)

電壓/頻率/Voltage/Frequency

220V AC±5%/50HZ

頂針Z高度行程/Thimble Z Height Stroke

80mil2mm

壓縮空氣/Compressed Air

4-6kg/cm?

額定功率/Rated Power

650W

3.圖像識別系統/Image Recognition System

耗氣量/Gas Consumption

5L/min

灰階度/Grey Scale

256級灰度(Level Grey)

8.體積及重量/Volume and Weight

解析度/Resolution

656×492圖元(Pixels)

xx/

Length x Width x Height

156×128×180cm

圖像識別精准度/Image Recognition Accuracy

±0.025mil@50mil觀測範圍(Observation Range)

重量/Weight

1250kg

 

快速通道
聯系澳门十大正规网站們
產品服務
公司介紹
新聞資訊
XML 地图 | Sitemap 地图